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Precision Engineering corrected by using Corrective Optics Space Telescope Axial Replacement (COSTAR), which is an optics package Using COSTAR, the telescope can achieve optical resolutions better than 01 arc seconds The Hubble has contributed to an extraordinary variety of astronomical discoveries, the most notable among them being the confirmation of dark matter, observations supporting the current accelerating universe theory, and studies of extra solar planets

Material characterization Dielectric withstanding voltage Glass transition temperature (DSC) Glass transition temperature (TMA) Glass transition temperature (DMA) Decomposition temperature Td CTE x,y (a1) CTE x,y (a2) CTE z (a1) CTE z (a2) Water absorption Flammability

Unit V/mil C C C C ppm/K ppm/K ppm/K ppm/K %

Test method IPC-TM-650, method 2.5.6 IPC-TM-650, method 2.4.25C IPC-TM-650, method 2.4.24C IPC-TM-650, method 2.4.24.2 IPC-TM-650, method 2.3.40 IPC-TM-650, method 2.4.41.2 IPC-TM-650, method 2.4.41.2 IPC-TM-650, method 2.4.24 IPC-TM-650, method 2.4.24 IPC-TM-650, method 2.6.2.1 UL-94

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During the qualification of a new material, it is also crucial to run the laminate through the production processes to check whether they are compatible. Table 12.5 summarizes all the steps that are necessary to control. The first process step is innerlayer processing. Here, a change in stiffness of the new laminate material can have a significant impact on the processability in horizontal manufacturing lines. This is especially important for thin cores. A change in the copper quality of the new laminate may impact the adhesion of the innerlayer photoresist and can also affect the copper etch rates. During automatic optical inspection (AOI), it is necessary to verify the contrast between copper circuitry and laminate and adjust the AOI settings if necessary. In case of necessary innerlayer repairs, the settings for the welding process may need adjustment to avoid thermal damage of the laminate and ensure reliable interconnects. The last step during innnerlayer processing is copper blackoxide. Here, it is necessary to verify the compatibility of the employed blackoxide (reduced/nonreduced or alternative) to the base material to obtain a sufficient innerlayer bond strength of the multilayer product. The dimensional stability of the innerlayers must be measured after the multilayer cycle to adjust the innerlayer scaling factors of the new material. The next step after multilayer lamination and edge routing is drilling. A change in the thermomechanical properties of the laminate may impact the quality of the drilled holes, and adjustments to drill speeds or desmear settings may be necessary. After metallization and plating, the adhesion of the copper in the plated through hole as well as reliable contacts to all innerlayers must be verified.

11 12 13 14 15 16 21 22 23 24 31 32 33 34 35 36 37 38 39 310 311 312 313 314 315 316 317 318 319 320 321 322 323 324 325 326 327 328 329 330 331 332 333 334 A digital circuit implemented using TTL ICs 4 The digital circuit in Figure 11 implemented using a PLD 4 An AVR microcontroller-based implementation for the logic equation 5 Timing diagrams 7 More timing diagrams 8 And some more timing diagrams 9 A microcontroller interfaces to external devices with a minimum of extra components An 8-bit microcontroller.

TABLE 12.5 Summary of Production Steps Compatibility with innerlayer (IL) process steps Preclean Resist lamination Exposure Develop, Etch, Strip Punching IL-Automatic optical inspection IL-Repair/outerlayer (OL)-repair Blackoxide/oxide alternatives Compatibility with multilayer process steps IL drying Lay up Press cycle Edge routing Dimensional stability check Compatibility with process steps from drill to electroless copper Drilling Brush/Pumice/Deburr Desmear/Plasma Desmear/Other E less copper or similar process Compatibility with soldermask process step Compatibility with different finish metallization processes Electroless Ni/Au Immersion Sn Immersion Ag Compatibility with routing process

Fig 127: The Hubble Space Telescope [3]

The adhesion of soldermask may also change as well when a new material is introduced. This is especially critical in combination with any metal finish process steps (such as electroless Ni/immersion Au, immersion Sn, and immersion Ag). In addition to having a negative impact on soldermask adhesion, these processes in combination with new laminates can also lead to nonselective metal plating or skip plating. One of the last manufacturing steps that should be evaluated during the introduction of a new laminate material is board routing and scoring. Here the use of a new base material with changed stiffness or different reinforcement may lead to necessary process adjustments.

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